JPH0215254Y2 - - Google Patents
Info
- Publication number
- JPH0215254Y2 JPH0215254Y2 JP4973185U JP4973185U JPH0215254Y2 JP H0215254 Y2 JPH0215254 Y2 JP H0215254Y2 JP 4973185 U JP4973185 U JP 4973185U JP 4973185 U JP4973185 U JP 4973185U JP H0215254 Y2 JPH0215254 Y2 JP H0215254Y2
- Authority
- JP
- Japan
- Prior art keywords
- rail
- side piece
- receiving part
- solder
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 12
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 2
- 238000005219 brazing Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4973185U JPH0215254Y2 (en]) | 1985-04-03 | 1985-04-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4973185U JPH0215254Y2 (en]) | 1985-04-03 | 1985-04-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61166476U JPS61166476U (en]) | 1986-10-15 |
JPH0215254Y2 true JPH0215254Y2 (en]) | 1990-04-24 |
Family
ID=30567198
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4973185U Expired JPH0215254Y2 (en]) | 1985-04-03 | 1985-04-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0215254Y2 (en]) |
-
1985
- 1985-04-03 JP JP4973185U patent/JPH0215254Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS61166476U (en]) | 1986-10-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0215254Y2 (en]) | ||
KR880700479A (ko) | 땜납 슬롯식 전기 단자 및 그 결합방법 | |
US5098009A (en) | Method for joining joint portions of electromagnetic wave shielding materials | |
GB1449154A (en) | Connector members for circuit boards | |
EP0409906A1 (en) | WELDING APPLICATION DEVICE. | |
JPH0389470A (ja) | 導体板用接触素子 | |
JPH0635382Y2 (ja) | 混成集積回路のリード端子取付構造 | |
JP2522598B2 (ja) | 半導体パッケ―ジ | |
JPH034044Y2 (en]) | ||
JPH11145599A (ja) | 表面実装部品の半田付け構造 | |
JPH0429583Y2 (en]) | ||
JP2530783Y2 (ja) | チップ部品の実装構造 | |
JPH0331085Y2 (en]) | ||
JPH037946Y2 (en]) | ||
JPH0341475Y2 (en]) | ||
JPH0354631B2 (en]) | ||
JP2867699B2 (ja) | ラジアルテーピング電子部品 | |
JPH0351952Y2 (en]) | ||
JPH0624858Y2 (ja) | 表示パネル | |
JPH06334292A (ja) | 可撓性基板の端子構造 | |
JP2512771Y2 (ja) | 電気部品用基板の端子はんだ付け構造 | |
JPH03154310A (ja) | 薄板導体の結合方法 | |
JPH0311943Y2 (en]) | ||
JPH0622978Y2 (ja) | 銀ろう付きリードピン | |
JPS5824432Y2 (ja) | コタイデンカイコンデンサ |